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首页> 外文期刊>Optics Letters >Depletion-mode carrier-plasma optical modulator in zero-change advanced CMOS
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Depletion-mode carrier-plasma optical modulator in zero-change advanced CMOS

机译:零变化高级CMOS中的耗尽模式载流子等离子体光调制器

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摘要

We demonstrate the first (to the best of our knowledge) depletion-mode carrier-plasma optical modulator fabricated in a standard advanced complementary metal-oxide-semiconductor (CMOS) logic process (45 nm node SOI CMOS) with no process modifications. The zero-change CMOS photonics approach enables this device to be monolithically integrated into state-of-the-art microprocessors and advanced electronics. Because these processes support lateral p-n junctions but not efficient ridge waveguides, we accommodate these constraints with a new type of resonant modulator. It is based on a hybrid microring/disk cavity formed entirely in the sub-90 nm thick monocrystalline silicon transistor body layer. Electrical contact of both polarities is made along the inner radius of the multimode ring cavity via an array of silicon spokes. The spokes connect to p and n regions formed using transistor well implants, which form radially extending lateral junctions that provide index modulation. We show 5 Gbps data modulation at 1265 nm wavelength with 5.2 dB extinction ratio and an estimated 40 fJ/bit energy consumption. Broad thermal tuning is demonstrated across 3.2 THz (18 nm) with an efficiency of 291 GHz/mW. A single postprocessing step to remove the silicon handle wafer was necessary to support low-loss optical confinement in the device layer. This modulator is an important step toward monolithically integrated CMOS photonic interconnects.
机译:我们展示了第一款(据我们所知)用标准先进的互补金属氧化物半导体(CMOS)逻辑工艺(45纳米节点SOI CMOS)制造的耗尽型载流子-等离子体光学调制器,没有进行任何工艺修改。零变化CMOS光子学方法使该器件可以单片集成到最新的微处理器和先进的电子设备中。因为这些过程支持横向p-n结,但不支持有效的脊形波导,所以我们通过新型谐振调制器来适应这些约束。它基于完全在90 nm以下的单晶硅晶体管主体层中形成的混合微环/磁盘腔。经由硅轮辐阵列,沿着多模环形腔的内半径进行两种极性的电接触。辐条连接到使用晶体管阱注入形成的p和n区域,这些注入形成了径向延伸的横向结,可提供折射率调制。我们展示了在1265 nm波长处的5 Gbps数据调制,消光比为5.2 dB,估计能耗为40 fJ / bit。在3.2 THz(18 nm)范围内展示了广泛的热调谐性能,效率为291 GHz / mW。为了支持器件层中的低损耗光学限制,必须执行一个单独的后处理步骤以去除硅处理晶圆。该调制器是迈向单片集成CMOS光子互连的重要一步。

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