Halogen & antimony-free flame retardant for molding compound of semiconductor

摘要

An environmentally friendly flame retardant has been developed for epoxy resin materials used for encapsulating semiconductors. It can secure flame resistance equal to or higher than that of conventional flame retardants and offers the high-level moisture resistance needed for semiconductor encapsulating materials. This has been achieved by studies focusing on nitrogen compounds and phosphorus compounds as replacements for the now outdated bromine and antimony flame retardant compounds. This developed flame retardant is highly versatile, making it potentially applicable to all grades of encapsulating materials.