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首页> 外文期刊>日本セラミックス協会学術論文誌 >Dependence of Sintered Electrode Ni Paste on Dispersed Ni Paste and Ni Powder Properties
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Dependence of Sintered Electrode Ni Paste on Dispersed Ni Paste and Ni Powder Properties

机译:烧结电极镍糊对分散镍糊和镍粉性能的依赖性

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摘要

We evaluated the characteristics of Ni paste used for internal electrodes of multilayer ceramic chip capacitors (MLCs) The effects of dispensability of BaTiO_3 powder in Ni paste and Ni powder properties on sinter-mg characteristics of electrode films were studied. The experimental results revealed that an improvement of dispensability of BaTiO_3 suppressed shrinkage of the films. It was observed that properties of Ni powder influenced on the shrinkage of electrode films, i.e., Ni powder prepared by the WCP method showed a higher shrinkage than that of the powder made by the CVD method. The similar results were observed on the surface microstructure of sintered electrode films by SEM measurements.
机译:我们评估了用于多层陶瓷片状电容器(MLCs)内部电极的Ni糊的特性。研究了BaTiO_3粉末在Ni糊中的可分散性和Ni粉末性能对电极膜的烧结mg特性的影响。实验结果表明,BaTiO_3分散性的改善抑制了薄膜的收缩。观察到Ni粉的性能影响电极膜的收缩,即,通过WCP方法制备的Ni粉显示出比通过CVD方法制备的粉末更高的收缩率。通过SEM测量在烧结电极膜的表面微观结构上观察到相似的结果。

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