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首页> 外文期刊>材料 >Estimation of Strength Reliability for Ceramic/Metal Jointing Structure -The Basic Study of Thermal Stress and Residual Stress Behavior during Ceramic/Metal Joint process
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Estimation of Strength Reliability for Ceramic/Metal Jointing Structure -The Basic Study of Thermal Stress and Residual Stress Behavior during Ceramic/Metal Joint process

机译:陶瓷/金属连接结构强度可靠性的估算-陶瓷/金属连接过程中热应力和残余应力行为的基础研究

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摘要

A simple analysis method was developed bymaking well use of finite element method (FEM) program forgeneral purposes. The temperature dependence of mechanicalproperties for every material consisting of ceramic/metaljointing was considered in this method. Using this method, theresidual stresses producing during the jointing process wereanalyzed for Si_3N_4/SUS304 joints with the insert layer of Cumade by an active metal brazing (Ti-Ag-Cu) method so as toclarify the residual stress behavior due to the creep of Cu. Theequivalent normal stress calculated from the multi-axial stresseswas used to evaluate the strength of fracture which resulted frominitial flaws existing in the ceramic side. From the analyticalresults, it is found that the temperature at which the residualstress begins to generate is about 550 deg C, and it is clarifiedthat the creep of Cu layer during cooling process may relax theresidual stress in ceramics side and can not be neglected for theestimation of ceramic fracture due to residual stress.
机译:通过充分利用有限元方法(FEM)程序来开发通用的简单分析方法。该方法考虑了每种由陶瓷/金属接头组成的材料的力学性能与温度的关系。使用这种方法,通过活性金属钎焊(Ti-Ag-Cu)方法分析了具有Cumade插入层的Si_3N_4 / SUS304接头在接合过程中产生的残余应力,从而阐明了由于Cu蠕变而产生的残余应力行为。由多轴应力计算出的等效法向应力用于评估由陶瓷侧存在的初始缺陷引起的断裂强度。从分析结果中可以发现,残余应力开始产生的温度约为550℃,并且可以清楚地表明,冷却过程中Cu层的蠕变可能会松弛陶瓷侧的残余应力,因此不能忽略该估算。残余应力导致陶瓷断裂。

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