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首页> 外文期刊>Journal of the Korean Physical Society >Crystallization of Silicon Films of Submicron Thickness byBlue-Multi-Laser-Diode Annealing
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Crystallization of Silicon Films of Submicron Thickness byBlue-Multi-Laser-Diode Annealing

机译:蓝多激光二极管退火技术对亚微米厚硅膜的晶化

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摘要

Blue-Multi-Laser-Diode Annealing (BLDA) was performed in the continuous wave (CW) mode on Si films as thick as 0.5μm and 1 μm deposited by rf sputtering. As a result of controlling the laser power from 4.0 to 4.8 W, a whole Si layer of 0.5 μm in thickness was completely crystallized and consisted of a columnar structure of fine grains beneath a partially melted Si surface owing to the high temperature gradient along the depth in the Si layer. After additional hydrogenation in a furnace ambient, the ratio of the photo/dark current under AM1.5 illumination distinctly improved to 6 times higher than that of as-deposited condition. The BLDA is expected to be applied to thin-film solar cells and/or to thin film transistor (TFT) photo-sensor systems on panels as a new low-temperature poly-silicon (LTPS) fabrication technique.
机译:以连续波(CW)模式对通过RF溅射沉积的厚度为0.5μm和1μm的Si膜进行蓝多激光二极管退火(BLDA)。通过将激光功率控制在4.0至4.8 W,整个厚度为0.5μm的Si层完全结晶,并且由于沿深度的高温梯度而在部分熔化的Si表面下由细晶粒的柱状结构组成在硅层中。在炉内环境中进行额外的氢化后,AM1.5光照下的光/暗电流比明显提高到比沉积条件下高6倍。 BLDA有望作为一种新型的低温多晶硅(LTPS)制造技术应用于薄膜太阳能电池和/或面板上的薄膜晶体管(TFT)光传感器系统。

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