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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Characteristics of silicon-based BaxSr1-xTiO3 thin films prepared by a sol-gel method
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Characteristics of silicon-based BaxSr1-xTiO3 thin films prepared by a sol-gel method

机译:溶胶-凝胶法制备硅基BaxSr1-xTiO3薄膜的特性

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Silicon-based BaxSr1-xTiO3 (BST) thin films have been prepared by a sol-gel method with rapid thermal annealing (RTA) processes. Phase structure of the films has been investigated by x-ray diffraction. Atomic force microscopy studies reveal a dense and smooth surface of the sol-gel prepared films. Microstructure and electrical properties of the BST films can be affected by the substrate and the annealing process. RTA method is found to be very efficient to improve the electrical properties of the films. Dielectric constant and dielectric loss of the BST films at 100 kHz are 230 and 0.02, respectively. Leakage current density of the BST capacitors is 1.6 x 10(-7) A cm(-2) at 3V. [References: 6]
机译:硅基BaxSr1-xTiO3(BST)薄膜已通过溶胶-凝胶法和快速热退火(RTA)工艺制备。膜的相结构已经通过X射线衍射研究。原子力显微镜研究显示溶胶-凝胶制得的薄膜致密且光滑的表面。 BST膜的微结构和电性能会受到基材和退火工艺的影响。发现RTA方法对于改善膜的电性能非常有效。 BST薄膜在100 kHz时的介电常数和介电损耗分别为230和0.02。 BST电容器在3V时的泄漏电流密度为1.6 x 10(-7)A cm(-2)。 [参考:6]

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