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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Model of plasma-based ion implantation around a round hole in a flat plate
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Model of plasma-based ion implantation around a round hole in a flat plate

机译:平板中圆孔周围基于等离子体的离子注入模型

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We use a two-dimensional hybrid simulation (particle ions and Boltzmann electrons) to study sheath and ion dynamics around a small round hole in a flat, conducting plate following the application of a large, negative voltage pulse, such as might be encountered during plasma-based ion implantation. Results for hole radii of an eighth and half the ion-matrix overlap length and for depths of one, two and four times the radius are reported. For all these cases, it is found that the hole represents a small perturbation to a planar sheath since the sheath width is always greater than the hole radius. Consequently, most of the ions that enter the hole impact on its bottom at near normal angles; only a small fraction impact on the sidewall obliquely.
机译:我们使用二维混合仿真(粒子离子和玻尔兹曼电子)研究在施加大的负电压脉冲(例如在等离子体过程中可能遇到的情况)后,在平坦的导电板中的小圆孔周围的鞘和离子动力学离子注入。据报道,孔半径为离子矩阵重叠长度的八分之一和一半,深度为半径的一倍,二倍和四倍的结果。对于所有这些情况,发现孔对平面护套的扰动很小,因为护套宽度总是大于孔半径。因此,大多数进入孔的离子都以接近法线的角度撞击孔的底部。仅一小部分倾斜地撞击侧壁。

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