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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Defects of ultrathin Cu films on Mo(110)studied by thermal helium desorption spectrometry
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Defects of ultrathin Cu films on Mo(110)studied by thermal helium desorption spectrometry

机译:热氦解吸光谱研究Mo(110)上超薄铜膜的缺陷

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摘要

Defects of ultrathin Cu films (3-200 A) deposited on Mo(1 1 0) at room temperature by e-beam evaporation in ultra-high vacuum are investigated using thermal helium desorption spectrometry. The samples are analysed with both 75 and 1000 eV He implantation. Cu films transform into islands on annealing and the temperature of this transformation is strongly thickness dependent. Helium release from defects close to the surface of the Cu films (~450 K), from monovacancies in as-deposited Cu film (50-200 A), and from defects close to the interface (800-1050 K) are identified. Annealing of monovacancies is mainly responsible for reduction in helium trapping in a 20 A Cu film prior to film islanding. There is an indication of retrapping of helium released from the first 5 _ layer of the film in the defects located in the overlayers (5-95 _ ). Helium in the Cu films survives until the desorption temperature of the film (1200-1300 K).
机译:使用热氦解吸光谱法研究了在超高真空下通过电子束蒸发在室温下沉积在Mo(1 1 0)上的超薄Cu膜(3-200 A)的缺陷。使用75和1000 eV He注入对样品进行分析。铜膜在退火时转变成岛状结构,并且该转变的温度与厚度密切相关。可以确定氦从铜膜表面附近的缺陷(约450 K),沉积的铜膜中的单空位(50-200 A)和界面附近的缺陷(800-1050 K)释放。单空位退火主要是为了减少薄膜孤岛之前20 A Cu薄膜中的氦气俘获。有迹象表明从薄膜的前5 _层释放的氦气会重新捕获在覆盖层(5-95 _)中的缺陷中。 Cu薄膜中的氦气一直存在,直到薄膜的解吸温度(1200-1300 K)。

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