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首页> 外文期刊>Journal of Micromechanics and Microengineering >Multi-field simulations and characterization of CMOS-MEMS high-temperature smart gas sensors based on SOI technology
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Multi-field simulations and characterization of CMOS-MEMS high-temperature smart gas sensors based on SOI technology

机译:基于SOI技术的CMOS-MEMS高温智能气体传感器的多场仿真和表征

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This paper describes multiple field-coupled simulations and device characterization of fully CMOS-MEMS-compatible smart gas sensors. The sensor structure is designated for gas/vapour detection at high temperatures (>300 ℃) with low power consumption, high sensitivity and competent mechanic robustness employing the silicon-on-insulator (SOI) wafer technology, CMOS process and micromachining techniques. The smart gas sensor features micro-heaters using p-type MOSFETs or polysilicon resistors and differentially transducing circuits for in situ temperature measurement. Physical models and 3D electro-thermo-mechanical simulations of the SOI micro-hotplate induced by Joule, self-heating, mechanic stress and piezoresistive effects are provided. The electro-thermal effect initiates and thus affects electronic and mechanical characteristics of the sensor devices at high temperatures. Experiments on variation and characterization of micro-heater resistance, power consumption, thermal imaging, deformation interferometry and dynamic thermal response of the SOI micro-hotplate have been presented and discussed. The full integration of the smart gas sensor with automatically temperature-reading ICs demonstrates the lowest power consumption of 57 mW at 300 ℃ and fast thermal response of 10 ms.
机译:本文介绍了完全兼容CMOS-MEMS的智能气体传感器的多个场耦合仿真和器件表征。该传感器结构采用绝缘体上硅(SOI)晶片技术,CMOS工艺和微加工技术,可用于高温(> 300℃)的气体/蒸汽检测,具有低功耗,高灵敏度和出色的机械坚固性。智能气体传感器具有微型加热器,该加热器使用p型MOSFET或多晶硅电阻器以及差动传感电路进行原位温度测量。提供了焦耳,自热,机械应力和压阻效应引起的SOI微热板的物理模型和3D电热机械模拟。在高温下,电热效应会启动并因此影响传感器设备的电子和机械特性。提出并讨论了微加热器电阻,功率消耗,热成像,形变干涉术和动态热响应的变化和表征的实验。智能气体传感器与自动读取温度的IC完全集成,表明在300℃时的最低功耗为57 mW,快速热响应为10 ms。

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