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Tape casting of high dielectric ceramic substrates for microelectronics packaging

机译:用于微电子封装的高介电陶瓷基材的流延铸造

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摘要

The production of ceramic green tapes is integral to the production of multilayer ceramic packages and capacitors. This article presents a batch type process for producing alumina ceramic green tape down to 150 μm thickness. The process parameters relevant to the precise control of the thickness of an alumina-based ceramic tape have been investigated using a float glass tape caster. Results indicate that the cast tape thickness was dependent on the blade gap until it reached a limiting value. This limiting thickness in turn was dependent on the casting speed, with a higher speed producing thinner tapes. Optimal casting was shown to exist when the blade gap was set at or beyond the limiting value, with the casting speed the controlling factor for the final thickness.
机译:陶瓷生带的生产对于多层陶瓷封装和电容器的生产必不可少。本文介绍了一种分批式工艺,用于生产厚度小于150μm的氧化铝陶瓷生带。已经使用浮法玻璃带铸造机研究了与精确控制氧化铝基陶瓷带厚度有关的工艺参数。结果表明,流延带的厚度取决于刀片间隙,直到达到极限值为止。该极限厚度又取决于铸造速度,更高的速度产生更薄的带。当叶片间隙设置为极限值或超出极限值时,可以显示出最佳的铸造效果,而铸造速度是最终厚度的控制因素。

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