首页> 外文期刊>Journal of Materials Chemistry, C. materials for optical and electronic devices >Facile preparation of graphite particles fully coated with thin Ag shell layers for high performance conducting and electromagnetic shielding composite materials
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Facile preparation of graphite particles fully coated with thin Ag shell layers for high performance conducting and electromagnetic shielding composite materials

机译:轻松制备完全覆盖有薄薄的Ag壳层的石墨颗粒,用于高性能导电和电磁屏蔽复合材料

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We have demonstrated a facile surface-functionalization method to achieve a high density of thiol groups on natural graphite particles (NGPs), which facilitates the fabrication of compact silver shells of about 50 nm in thickness on the surface of NGPs by electroless silver plating. In our protocol, the addition of water and ammonia in the modification not only promotes the condensation of free hydrolyzed 3-mercaptopropyltrimethoxysilane (MPTMS) molecules with the hydroxyl groups on NGPs, but also enhances their self-polymerization due to MPTMS being grafted on the NGPs. In this way, simply optimizing the volume ratio of H2O to MPTMS (V-H2O:V-MPTMS) in the modification can make the density of thiol groups (N-SH) on the surface of NGPs to be as high as similar to 52 -SH groups per nm(2), which subsequently produces thin and compact silver shells on NGPs by creating dense Ag nuclei. Compared with the previously reported silver-coated non-metallic core-shell composite particles, the as-synthesized NG@Ag core-shell composite particles (NG@Ag CSCPs) show a high conductivity of 1.71 x 10(6) S m(-1) even when the Ag content is as low as 32 wt%, implying the advantages of low density, high thermal stability and low cost. The polymer-based composite materials based on them exhibit excellent conductivity, strong shielding effectiveness and good anti-sedimentation, as well as good mechanical properties, conducting stability and small filling volume percentage, suggesting that the as-synthesized NG@Ag CSCPs are promising materials for applications in conductive and electromagnetic shielding composite materials.
机译:我们已经证明了一种简便的表面官能化方法,可在天然石墨颗粒(NGP)上实现高密度的硫醇基团,这有助于通过化学镀银在NGP的表面上制造厚度约为50 nm的紧凑银壳。在我们的方案中,在修饰中添加水和氨不仅促进游离水解的3-巯基丙基三甲氧基硅烷(MPTMS)分子与NGP上的羟基缩合,而且由于将MPTMS接枝到NGP上而增强了它们的自聚合。 。这样,只需在修改中优化H2O与MPTMS的体积比(V-H2O:V-MPTMS),即可使NGP表面的巯基(N-SH)密度高达52每纳米(2)的-SH基团,随后通过产生致密的Ag核在NGP上产生薄而紧凑的银壳。与先前报道的涂银的非金属核-壳复合颗粒相比,合成后的NG @ Ag核-壳复合颗粒(NG @ Ag CSCP)显示出1.71 x 10(6)S m(- 1)即使当Ag含量低至32wt%时,也暗示了低密度,高热稳定性和低成本的优点。基于它们的聚合物基复合材料具有优异的导电性,强屏蔽性能和良好的抗沉降性,以及良好的机械性能,导电稳定性和较小的填充体积百分比,这表明合成后的NG @ Ag CSCPs是很有前途的材料适用于导电和电磁屏蔽复合材料。

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