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In situ iodoalkane-reduction of graphene oxide in a polymer matrix: an easy and effective approach for the fabrication of conductive composites

机译:原位碘代烷烃在聚合物基体中氧化石墨烯的还原:导电复合材料制造的一种简单有效的方法

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摘要

In situ chemical reduction (ISCR) of graphene oxide (GO) dispersed in a polymer matrix has been regarded as an effective path to fabricate electrically conductive graphene/polymer composites due to the combination of perfect dispersion of GO in a polymer matrix and high electrical conductivity of graphene. However, there are only very limited number of reducing agents that can be applied to the ISCR process for the fabrication of graphene/polymer composites. Herein, we report a highly efficient reducing agent, 1,2-diiodoethane, which can be used in the preparation of graphene (IGO)/polyimide (PI) composites via the ISCR process. The results showed that the electrical conductivity of IGO/PI composites with 2.5 wt% of IGO was 2.22 S m(-1), nearly seven orders of magnitudes higher than that of GO/PI without the addition of 1,2-diiodoethane. Moreover, the tensile strength and modulus of IGO/PI composites were increased by about 43% and 52% as compared with that of the pure PI, respectively. Furthermore, 1,2-diiodoethane and its decomposition products would not remain in the composites. The ISCR-based methodology can be extended to many other polymer composites and thus paves the way for easy and effective fabrication of conductive polymer composites.
机译:原位化学还原(ISCR)分散在聚合物基质中的氧化石墨烯(GO)已被视为制造导电石墨烯/聚合物复合材料的有效途径,这是由于GO在聚合物基质中的完美分散和高电导率的结合石墨烯。但是,仅有极少数的还原剂可用于ISCR工艺来制造石墨烯/聚合物复合材料。本文中,我们报道了一种高效还原剂1,2-二碘乙烷,可通过ISCR工艺将其用于制备石墨烯(IGO)/聚酰亚胺(PI)复合材料。结果表明,含IGO 2.5 wt%的IGO / PI复合材料的电导率为2.22 S m(-1),比不添加1,2-二碘乙烷的GO / PI高7个数量级。而且,与纯PI相比,IGO / PI复合材料的拉伸强度和模量分别提高了约43%和52%。此外,1,2-二碘乙烷及其分解产物不会残留在复合材料中。基于ISCR的方法可以扩展到许多其他聚合物复合材料,从而为轻松有效地制造导电聚合物复合材料铺平了道路。

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