Development of temperature sensor thin films to monitor turning processes

摘要

Increasing demands on the cutting process require a fundamental analysis concerning the design as well as the material selection for cutting insert and its wear protection. Apart from monitoring the wear and the cutting forces, the knowledge of the developed temperatures during cutting process is essential and necessary. In this work, an innovative technology was employed to measure in situ the temperature development during cutting process. The measurement was based on the Seebeck-effect. Coating adhesion was systematically analyzed and optimized by varying the pretreatment conditions. Furthermore, the design of masks was enhanced and finally turning experiments were carried out to scrutinize the efficiency of deposited temperature sensors in cutting tests.