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An investigation of the effects of the tool path on the removal of material in polishing

机译:研究刀具路径对抛光中材料去除的影响

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Uniformity of removal affects the finishing, and in some cases, the form accuracy of the polished surface. Tool paths are required for the automation of surface polishing. How the tool path may affect the removal of material in polishing is investigated in this paper. An analysis of how removal at a location due to polishing along adjacent path lines is presented. Four tool paths reportedly used in polishing are covered: scanning, bi-scanning, Hilbert and Peano paths. Removal in the inner surface as well as near the edges of surfaces is examined through simulations and analysis. The results show that, for the same path pitch, the peak-to-valley height (h_(pv)) in the inner part of the removal map is the same for scanning, bi-scanning and Peano, while the texture of the removal maps can be quite different. The h_(pv) values of Hilbert are more than double those of Peano, although both are fractal paths. Removal near the edges is particularly severe for scanning-type tool paths. The ratio of the edge peak height to the inner peak height is about 1.6 on average for scanning. The uniformity of removal further deteriorates as the ellipticity of the tool contact increases. When the contact direction is closely aligned with the path line direction, that ratio goes up to about 2.9 for contact ellipticity of 2. Polishing experiments have also been conducted. Both experiments and simulations point to the presence of edge effects in scanning paths and its absence in Peano paths. It is further proposed that, for more uniform removal of material: (1) changes in the tool path direction should be well distributed and (2) the direction of the path lines should be well balanced over the entire surface.
机译:去除的均匀性会影响抛光表面的光洁度,在某些情况下会影响抛光表面的形状精度。为了自动进行表面抛光,需要使用刀具路径。本文研究了刀具路径如何影响抛光中材料的去除。提出了如何分析由于沿相邻路径线的抛光而导致的位置去除的分析。涵盖了据报道用于抛光的四种刀具路径:扫描,双向扫描,希尔伯特和皮亚诺路径。通过模拟和分析检查内表面以及表面边缘附近的去除。结果表明,对于相同的路径间距,去除图内部的峰谷高度(h_(pv))对于扫描,双向扫描和Peano而言是相同的,而去除纹理地图可以完全不同。 Hilbert的h_(pv)值是Peano的h_(pv)的两倍以上,尽管两者都是分形路径。对于扫描型刀具路径,边缘附近的去除尤其严重。扫描的边缘峰高与内部峰高之比平均约为1.6。随着工具接触的椭圆率的增加,去除的均匀性进一步恶化。当接触方向与路径线方向紧密对准时,接触椭圆率为2时,该比率上升到大约2.9。还进行了抛光实验。实验和模拟都指出在扫描路径中存在边缘效应,而在Peano路径中则没有边缘效应。进一步建议,为了更均匀地去除材料:(1)刀具路径方向的变化应分布均匀,(2)路径线的方向应在整个表面上保持平衡。

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