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首页> 外文期刊>Journal of Materials Processing Technology >Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting
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Modeling of high temperature- and diffusion-controlled die soldering in aluminum high pressure die casting

机译:铝高压压铸中高温和扩散控制的压模焊接建模

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Soldering of cast alloys to the dies has been a continuing source of die surface damage in the aluminum die-casting industry. To reduce the repair and maintenance costs, an approach to modeling the damage and predicting the die lifetime is required. The aim of the present study is the estimation of the die lifetime based on a quantitative analysis of die soldering in the framework of the numerical simulations of the die-casting process. Full 3D simulations of the process, including the filling, solidification, and the die cooling, are carried out using the casting simulation software MAGMAsoft. The resulting transient temperature fields on the die surface and in the casting are then post-processed to estimate the die soldering. The present work deals only with the metallurgical/chemical kind of soldering which occurs at high temperatures and involves formation and growth of intermetallic layers. The die-soldering model combines two approaches available in literature, describing the two aspects of die soldering: the growth of the intermetallic layer, and the thermal and metallurgical conditions in the layer that lead to the die soldering. The theoretical model is then extended with the treatment of the intermetallic layer growth controlled by the idealized effective diffusivity and with the treatment of solder strength dependent on the temperature and liquid fraction within the layer. The solder strength locally on the die surface is calculated as a function of the number of die-casting cycles. This also provides the estimation of the die lifetime defined as the number of cycles until the critical solder strength level is reached. Proper validation of the model is required, and the model parameters (the critical solder strength value, among others) need to be calibrated by measurements and data from the die-casting industry. As an example, the model is applied to several cases of high pressure die casting (HPDC) where A380 alloy parts are cast in the H13 steel die. The predicted locations of the higher strength of soldering appear in the "hot spot" areas of the die surface in agreement with the reports in literature. The influence of several casting process parameters such as cooling/spraying efficiency and other parameters that control the thermal history of the die and the casting is in agreement with the expected behavior.
机译:在铝压铸工业中,将铸造合金焊接到模具上一直是模具表面损坏的持续来源。为了减少维修和维护成本,需要一种对损坏进行建模并预测模具寿命的方法。本研究的目的是在压铸过程数值模拟的框架内,基于对压焊的定量分析,估计压铸寿命。使用铸造仿真软件MAGMAsoft对过程进行完整的3D仿真,包括填充,固化和模具冷却。然后对模具表面和铸件中产生的瞬态温度场进行后处理,以估计模具焊接。本工作仅涉及冶金/化学类型的钎焊,这种钎焊在高温下发生并且涉及金属间层的形成和生长。芯片焊接模型结合了文献中提供的两种方法,描述了芯片焊接的两个方面:金属间层的生长以及层中导致芯片焊接的热和冶金条件。然后,通过理想化的有效扩散率控制的金属间层生长的处理以及取决于层内温度和液体分数的焊锡强度的处理,扩展了理论模型。根据压铸循环次数来计算模具表面局部的焊接强度。这也提供了对芯片寿命的估计,该寿命定义为达到关键焊接强度水平之前的循环次数。需要正确验证模型,并且需要通过压铸行业的测量和数据来校准模型参数(关键的焊接强度值等)。例如,该模型适用于几种高压压铸(HPDC)情况,其中A380合金零件在H13钢压铸件中铸造。与文献报道相一致,较高强度焊接的预测位置出现在模具表面的“热点”区域。几种铸造工艺参数(例如冷却/喷涂效率)以及其他控制模具和铸件热历史的参数的影响与预期行为一致。

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