A new non-uniform structure is presented to reduce the crosstalk and maximize the delivered power to the main load in VLSI circuits. This interconnect is designed to meet the matching requirements in the load (user) and the source (die). In this structure some grounded non-uniform lines are added in the empty space between signal traces and so no additional space is required. This structure is compared with the conventional interconnects. The method of the solution is based on steplines approximation of non-uniform lines and modal decomposition method for the coupled lines.
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