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首页> 外文期刊>Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena >Deformation Behavior of Semi-Solid ZCuSn10P1 Copper Alloy During Isothermal Compression
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Deformation Behavior of Semi-Solid ZCuSn10P1 Copper Alloy During Isothermal Compression

机译:半固态ZCuSn10P1铜合金的等温压缩变形行为

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The isothermal compression tests of semi-solid ZCuSn10P1 alloy by strain induced melt activation (SIMA) process are carried out by Gleeble-1500 thermo-mechanical simulator, and the same tests are finished to samples of as-cast ZCuSn10P1 alloy. The deformation temperature respectively is 910°C, 920°C and 930°C, and the strain respectively is 0.4 and 0.6, the strain rate is 0.5s~(-1), 1s~(-1) and 10~(-1). The experimental results indicate that the deformation resistance of semi-solid ZCuSn10P1 copper alloy with smaller, more uniform and rounder solid grain is about half of the as-cast ZCuSn10P1 copper alloy. The deformation resistance of ZCuSn10P1 alloy by SIMA process decreases with the deformation temperature increasing, and the deformation resistance increases with the strain rate increasing.
机译:利用Gleeble-1500热力机械模拟器通过应变诱导熔体活化(SIMA)方法对半固态ZCuSn10P1合金进行了等温压缩试验,并对铸态ZCuSn10P1合金样品进行了相同的试验。变形温度分别为910°C,920°C和930°C,应变分别为0.4和0.6,应变速率为0.5s〜(-1),1s〜(-1)和10〜(-1 )。实验结果表明,具有更小,更均匀和更圆的固态晶粒的半固态ZCuSn10P1铜合金的抗变形能力约为铸态ZCuSn10P1铜合金的一半。 SIMA工艺对ZCuSn10P1合金的变形阻力随着变形温度的升高而减小,而变形阻力随着应变率的增大而增大。

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