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首页> 外文期刊>Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology >A Theoretical Study of Thin Film Delamination Using Clamped Punch-Loaded Blister Test: Energy Release Rate and Closed-Form Solution
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A Theoretical Study of Thin Film Delamination Using Clamped Punch-Loaded Blister Test: Energy Release Rate and Closed-Form Solution

机译:夹紧式冲孔吸塑测试薄膜分层的理论研究:能量释放率和闭合形式的解决方案

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摘要

Using an exact analytical solution of axisymmetric deformation of a circular membrane centrally connected to a rigid plate under the action of concentrated load at its center, we present an exact formula for the energy release rate applicable to ultrathin film-substrate systems without residual stresses or with small residual stresses. Also, a closed-form solution of axisymmetric deformation of circular membrane under the action of concentrated load at its center is presented.
机译:使用在中心处集中载荷作用下与刚性板中心连接的圆形膜的轴对称变形的精确解析解,我们给出了适用于无残余应力或具有超应力的超薄膜-薄膜系统的能量释放速率的精确公式。小残余应力。此外,提出了圆形薄膜在中心载荷集中作用下轴对称变形的封闭形式解。

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