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首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >High-density microwave plasma for high-rate and low-temperature deposition of silicon thin films
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High-density microwave plasma for high-rate and low-temperature deposition of silicon thin films

机译:高密度微波等离子体,可高速率和低温沉积硅薄膜

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摘要

A novel high-density microwave plasma utilizing a spokewise antenna was produced and applied for high-rate and low-temperature deposition of hydrogenated microcrystalline silicon (μc-Si: H) film. The plasma maintains a uniform state, i.e., high electron density, n{sub}e> 10{sup}11 cm{sup}(-3) and low temperature, T{sub}e of 2-2.5 eV in pure Ar plasma over 20 cm in a diameter. High deposition rate was achieved of 47 A/s in the growth of highly crystallized and photoconductive μc-Si: H film at the axial distance, Z = 6 cm from the quartz glass plate from SiH{sub}4 and Ar without the use of H{sub}2 dilution method at low substrate temperature, T{sub}s of 250℃. The effects of the total pressure, H{sub}2 dilution ratio, flow rate of SiH{sub}4, Fr(SiH{sub}4) and the axial distance, Z from the quartz glass plate on the μc-Si: H film deposition are discussed along with the plasma diagnostics.
机译:产生了一种新的利用辐条天线的高密度微波等离子体,并将其应用于氢化微晶硅(μc-Si:H)膜的高速率和低温沉积。等离子体在纯Ar等离子体中保持均匀状态,即高电子密度n {sub} e> 10 {sup} 11 cm {sup}(-3)和低温T {sub} e为2-2.5 eV直径超过20厘米。在高度结晶和光导性的μc-Si:H膜的轴向距离Z = 6 Si / SiH {sub} 4的石英玻璃板和Ar中生长的情况下,无需使用硅藻土即可获得47 A / s的高沉积速率。 H {sub} 2稀释法在低底物温度下,T {sub} s为250℃。总压力,H {sub} 2稀释比,SiH {sub} 4的流量,Fr(SiH {sub} 4)以及从石英玻璃板到μc-Si的轴向距离Z的影响:H膜沉积与等离子体诊断一起讨论。

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