Development and modelling of temperature gradient TLP bonding: a new method for joining advanced materials

摘要

A novel method for joining aluminium-based materials has been developed that is capable of reliably providing excellent bonds with parent material shear strengths. The new method relies on imposing a temperature gradient across the bond line whentransient liquid phase (TLP) bonding, and this leadsto the formation of non-planar interfaces. The evolution of a sinusoidal or cellular (non-planar) bond line is a particularly important feature of this method. Bond strengths are increased because of the higher metal-to-metal contact along the non-planarinterfaces, as compared with the planar interfaces associated with either conventional TLP or solid-state diffusion bonding processes. A comprehensive analytical model, capable of predicting bonding times and microstructures of bonds, has also beendeveloped and then verified using the experimental results.