X-ray fluorescence analysis of lead in tin coating using the theoretical intensity of scattered x-rays

摘要

Quantitative analysis of lead in tin-plated electronic components is reported. The fundamental parameter method is used, by using bulk solders as the standard sample. The scattered x-ray monitor method is additionally used to obtain the measured intensity ratio of fluorescent and scattered x-rays to correct the results. This is necessary because the electronic components analyzed do not have a large and smooth surface suitable for quantitative analysis. An analytical result of 6.0 mu m film thickness and 1430 ppm lead concentration is obtained for a 5.4 mu m thickness and 1388 ppm concentration sample using the scattered x-ray monitor method. Copyright (C) 2008 John Wiley & Sons, Ltd.