Loctite Corporation, part of the Henkel Group, has introduced new Multicore MP200 no-clean solder paste. Multicore MP200 is described as a high activity, soft, colourless, low residue, no-clean solder paste that exhibits excellent print definition with long open and abandon time capabilities for manufacturing facilities that have frequent set-ups. The high activity of the MP200 flux is said to offer excellent wetting to a wide range of surface finishes, and an exceptional reflow process window. MP200 is available with the 63S4 anti4ombstoning alloy, as well as standard J-STD-005 Type 3 tin lead alloys. MP200 is also being tested with fine pitch powder sizes for 0201 passive components and 0.5 mm pitch CSPs.
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