首页> 外文期刊>Techno Japan >Fabrication of ball semiconductors
【24h】

Fabrication of ball semiconductors

机译:球形半导体的制造

获取原文
获取原文并翻译 | 示例
           

摘要

It has been several years since a ball semiconductor was proposed as a new product that would be capable of breaking through the limitation of present day semiconductors. The proposer was Ball Semiconductor Inc. which has been engaged in putting such a semiconductor into practical use. How can you build electronic circuits into a small ball? This was really a very interesting question. Risuke Toda of Ball Semiconductor has issued a report on some aspects of the micromaching of ball semiconductors in the 36. No.5 issue of the Journal of Ceramics. The objective of Toda was to create a semiconductor on a 1mm sphere having three times as much area as a 1mm{sup}2 chip. For the time being, the diameter of this spherical semiconductor is set at 1mm, but the future effort is to make it smaller.
机译:球形半导体作为一种新产品被提出已经有几年了,它将能够突破当今半导体的局限性。提出者是Ball Semiconductor Inc.,该公司一直致力于将这种半导体投入实际使用。您如何将电子电路变成一个小球?这确实是一个非常有趣的问题。 Ball Semiconductor的Toda Risuke Toda在《陶瓷杂志》第36卷第5期上发表了有关球形半导体微加工某些方面的报告。 Toda的目标是在面积为1mm {sup} 2芯片三倍的1mm球面上创建半导体。目前,该球形半导体的直径设置为1mm,但是未来的努力是使其更小。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号