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首页> 外文期刊>Tetrahedron >Electrophilic Metal-Alkyl bond Cleavage in Tetraorganosilicon and Tetraorganotin Compounds by Lead Tetracarboxylates and Aryllead Tricarboxylates
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Electrophilic Metal-Alkyl bond Cleavage in Tetraorganosilicon and Tetraorganotin Compounds by Lead Tetracarboxylates and Aryllead Tricarboxylates

机译:四羧酸铅和三羧酸铅铅在四有机硅和四有机锡化合物中的亲电金属-烷基键裂解

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摘要

Methyl-silicon bond cleavage of tetramethylsilane occurs with aryllead(IV) tricaboxylates in trifluoroacetic acid to produce aryl(methyl)lead(IV) bistrifluoroacetates in high yield. An extension of the study to tetraalkylstannanes has shown that alkyl-tin cleavage by lead(IV) carboxylates proceeds even in chloroform, while a detailed study of the reactions of lead tetraacetate with tetraalkylstannanes indicated the reaction to be an electrophilic cleavage rather than one involving an electron transfer mechanism.
机译:四甲基硅烷的甲基-硅键裂解与三氟乙酸中的芳基铅(IV)三aboxylates发生,以高收率生产芳基(甲基)铅(IV)双三氟乙酸盐。这项研究扩展到四烷基锡烷,表明即使在氯仿中,羧酸铅(IV)也会裂解烷基锡,而对四乙酸铅与四烷基锡的反应的详细研究表明,该反应是亲电裂解,而不是涉及电子转移机理。

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