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首页> 外文期刊>Quantitative Infra Red Thermography Journal >Full-frame infrared thermal imaging of power electronics devices by means of multiple time-delayed measurements
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Full-frame infrared thermal imaging of power electronics devices by means of multiple time-delayed measurements

机译:通过多次延时测量对电力电子设备进行全帧红外热成像

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摘要

The paper presents a method for mapping the temperature distribution of very fast transient events (i.e. having a bandwidth of 10kHz or more) by means of a standard infrared camera working at 25Hz frame rate with 320x256 pixels full frame. The proposed method is based on triggering multiple time-delayed acquisitions of the observed thermal phenomenon, which must be periodic, by means of a very precise and stable programmable digital micro-controller and by reconstructing the time domain IR sequence using the frames acquired at each trigger event. The measurement accuracy of the reconstruction process has been assessed by using a laser-cut planar resistor cyclically heated by means of a pulsed electrical current. A practical application to investigate the temperature distribution over the source metal of a power MOSFET device is finally presented.
机译:该论文提出了一种方法,该方法通过以25Hz帧频,320x256像素全帧工作的标准红外摄像机绘制非常快速的瞬态事件(即带宽为10kHz或更高)的温度分布图。所提出的方法基于触发观测到的热现象的多个时延采集,该采集必须是周期性的,借助于非常精确且稳定的可编程数字微控制器,并使用在每个时采集的帧重建时域IR序列触发事件。重建过程的测量精度已通过使用激光切割的平面电阻器进行了评估,该电阻器通过脉冲电流循环加热。最后提出了研究功率MOSFET器件源极金属温度分布的实际应用。

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