X-ray imaging sees chip defects

摘要

Chip-scale packages (CSPs) are now just slightly larger than the die-and-lead frame that they hermetically enclose. This advanced packaging system for integrated circuits (ICs) includes ball-grid-array (BGA) and column-grid-array (CGA) packages. To accommodate the hundreds of I/O ports on current ICs, connectors are fastened to the bottom of the chip, with solder balls or columns connecting the underside of the printed wiring assembly. Because the connections join the IC and the underlying board, automated-optical-inspection equipment is able to inspect the attached ICs. Like many OEM suppliers, SoPark Corp. (Buffalo, NY, USA), a contract electronics manufacturer with a broad product mix, has had to adapt its manufacturing lines to include CSP components. To accomplish that changeover, SoPark turned to YESTech Inc. (San Clemente, CA, USA) to provide an inspection system that would improve the BGA attachment process and reduce board rework.