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The use of synchrotron radiation techniques in the characterization of strained semiconductor heterostructures and thin films

机译:同步辐射技术在应变半导体异质结构和薄膜表征中的应用

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摘要

In the last couple of decades, high-performance electronic and optoelectronic devices based on semiconductor heterostructures have been required to obtain increasingly strict and well-defined performances, needing a detailed control, at the atomic level, of the structural composition of the buried interfaces. This goal has been achieved by an improvement of the epitaxial growth techniques and by the parallel use of increasingly sophisticated characterization techniques. Among them, a leading role has been certainly played by those exploiting synchrotron radiation (SR) sources. In fact synchrotron radiation has distinct advantages as a photon source, notably high brilliance and continuous energy spectrum; by using the latter characteristic atomic selectivity can be obtained and this is of fundamental help to investigate the structural environment of atoms present only in a few angstrom (A) thick interface layers of heterostructures. The third generation synchrotron radiation sources have allowed to reach the limit of measuring a monolayer of material, corresponding to about 10~(14) atoms/cm~2. Since, in the last decade, the use of intentionally strained heterostructures has greatly enhanced the performance of electrical and electro-optical semiconductor, a particular attention will be devoted to intentionally strained superlattices. First the effect of strain on the band lineups alignments in strained heterostructures will be discussed deeply. Then the attention will be focused on to review the most important results obtained by several groups in the characterization of semiconductor heterostructures using the following structural SR techniques: (ⅰ) X-ray absorption-based techniques such as EXAFS, polarization-dependent EXAFS, surface EXAFS and NEXAFS (or XANES); (ⅱ) X-ray diffraction-based techniques such as high-resolution XRD, grazing incidence XRD, XRD reciprocal space maps, X-ray standing waves and diffraction anomalous fine structure (DAFS); (ⅲ) photoelectron-based techniques.
机译:在过去的几十年中,已经需要基于半导体异质结构的高性能电子和光电设备来获得越来越严格和定义明确的性能,需要在原子级别上详细控制掩埋界面的结构组成。通过改进外延生长技术和并行使用日趋复杂的表征技术已经实现了该目标。其中,那些利用同步加速器辐射(SR)源的人无疑已经发挥了领导作用。实际上,同步加速器辐射作为光子源具有明显的优势,特别是具有高亮度和连续能谱。通过使用后者的特性,可以获得原子选择性,这对于研究仅存在于几埃(A)厚异质结构界面层中的原子的结构环境具有根本帮助。第三代同步加速器辐射源已达到测量材料单层的极限,相当于大约10〜(14)原子/ cm〜2。由于在过去的十年中,故意应变的异质结构的使用大大提高了电和电光半导体的性能,因此将特别关注故意应变的超晶格。首先,将深入讨论应变对应变异质结构中能带排列的影响。然后,注意力将集中在回顾使用以下结构SR技术表征半导体异质结构中,由多个小组获得的最重要结果:(ⅰ)基于X射线吸收的技术,例如EXAFS,偏振相关的EXAFS,表面EXAFS和NEXAFS(或XANES); (ⅱ)基于X射线衍射的技术,例如高分辨率XRD,掠入射XRD,XRD倒数空间图,X射线驻波和衍射异常精细结构(DAFS); (ⅲ)基于光电子的技术。

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