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Anti-Reflective Coatings: A Story of Interfaces

机译:防反射涂层:界面的故事

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摘要

The semiconductor manufacturing industry has moved into an era where lithographic patterning can no longer be performed by simply coating the wafer with a layer of photoresist, exposing and developing that photoresist and then etching the desired feature onto the wafer's surface (the photoresist acts as a mask). Instead, it is necessary to deposit an extra layer - maybe two or three -before the photoresist is spun on. This extra layer is designed to prevent reflection of light that is transmitted through the photoresist, reflected off the substrate and back into the photoresist, where it can interfere with incoming light and cause the resist to be unevenly exposed.
机译:半导体制造业已经进入了一个时代,不再可以通过简单地在晶片上涂覆一层光致抗蚀剂,对光致抗蚀剂进行曝光和显影,然后在晶片的表面上蚀刻所需的特征来进行光刻图案化(光致抗蚀剂充当掩模) )。取而代之的是,必须在旋涂光致抗蚀剂之前先沉积一层额外的层-可能是两层或三层。设计该额外的层是为了防止反射穿过光致抗蚀剂的光,从基板反射回来并返回到光致抗蚀剂中,在光中它会干扰入射光并导致抗蚀剂曝光不均匀。

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