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RF MEMS Switches and Their Packaging Challenge

机译:RF MEMS开关及其封装挑战

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摘要

Though still in its infancy, MEMS (microelectromechan-ical systems) technology is more than a vision ― it is a reality. Reed Business Information's In-Stat Group reported a total market volume of more than $4B in 2001 for MEMS devices, predominantly for sensors and display devices. It estimates that this market will grow to $12B by 2005. One untapped area of potential promise for this technology is in the fast-growing arena of rf applications. Although the total current market for rf MEMS devices is less than $1M, In-Stat estimates that it will grow to more than $350M in the next five years. The use of micromachining ― etching macro structures in silicon ― has already been applied to fabricating integrated passives. By etching around the sides of spiral inductor elements, for example, potentially lossy dielectric can be removed and the Q of filters significantly increased. Integrated passives fabricated with micromachining will play an important role in increasing the integration level of rf devices, moving toward the goal of the single-chip rfsystem-on-a-chip.
机译:尽管仍处于起步阶段,但MEMS(微机电系统)技术不仅仅是一个愿景,而是一个现实。 Reed商业信息公司的In-Stat组报告称,2001年MEMS设备的市场总量超过$ 4B,主要是传感器和显示设备。它估计,到2005年,该市场将增长到$ 12B。对于这项技术,潜在的希望尚未开发的领域是RF应用的快速增长领域。尽管目前射频MEMS器件的总市场规模不到100万美元,但In-Stat估计在未来五年内,该市场将增长到3.5亿美元以上。使用微加工(在硅中蚀刻宏观结构)已被用于制造集成无源元件。例如,通过在螺旋电感器元件的侧面进行蚀刻,可以去除潜在的损耗电介质,并显着提高滤波器的Q。通过微机械加工制造的集成无源器件将在提高射频设备的集成度方面发挥重要作用,朝着单芯片射频系统级芯片的目标迈进。

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