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Relation of Deposition Condition with Microstructure of YBCO Film an YSZ Buffer Layer on Metallic Substrate

机译:沉积条件与金属基体上YSZ缓冲层的YBCO薄膜的微观结构的关系

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摘要

Microstructures of two Yba_2 Cu_3 O_7-y (YBCO) film deposited on metal substrate (Hastelloy-C) with yttria-stabilized zirconia (YSZ) buffer layer were studied comparatively. Relation of microstructure with deposition condition was also been discussed. The YSZ buffer flayer with a low depositing rate is dense, even, textured and well-bonded to the substrate. On the contrary, the YSZ layer deposited with a high rate is loose and bonded badly to the substrate. Property and surface grain size of YBCO film fare related to the substrate temperature (T_s) in the deposition process.
机译:比较研究了两层Yba_2 Cu_3 O_7-y(YBCO)薄膜的微观结构,该薄膜沉积在具有氧化钇稳定的氧化锆(YSZ)缓冲层的金属基板(Hastelloy-C)上。还讨论了微观结构与沉积条件的关系。具有低沉积速率的YSZ缓冲芯层致密,均匀,纹理化并与基材良好粘合。相反,以高速率沉积的YSZ层是疏松的并且与基底的结合不良。 YBCO薄膜的性能和表面晶粒尺寸与沉积过程中的基板温度(T_s)有关。

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