The Survival and Long-Term Reliability of LEAD-FREE PCBs

摘要

Significant attention and a great deal of effort have been expended on understanding the reliability of lead-free solder joints. However, difficulties posed by lead-free soldering as it relates to the reliability of PCB interconnect structures is perhaps more significant. Problems with PCB viability after the assembly process comes primarily from one source - the temperatures required to attach components during the lead-free assembly soldering process. These reliability issues required the development of a White Paper1 from which the materials in this article were taken.