Embedding integrated circuits (IC) within a multilayer package dates back to the work of Gene Weiner at MIT's Lincoln Laboratory in 1950. The team placed devices within resin and routed interconnections by mechanical drilling.~1 However, the leapfrog work is credited to General Electric. In the early 1990s, the company accomplished the real embodiment of chips in a multilayer package.~2 Since the inception of GE's "chip first" process, several approaches have been undertaken in embedding chips into polymer and other thin core matrices.
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