Open Solder Joints on BTCs

摘要

THE OPEN SOLDER joint on this BTC area array package was caused by poor paste volume control. The solder volume was not sufficient to create a joint. As there was evidence of solder wetting on the component pad, the device was in contact with the paste during initial reflow. It is assumed the wetting to the PCB pad was faster than the component termination, which is the reason for the separation.