Generation-After-Next Power Electronics: Ultrawide-bandgap devices, high-temperature packaging, and magnetic nanocomposite materials

摘要

A new generation of power electronic conversion systems is being enabled by wide-bandgap (WBG) devices. Applications in both the civilian and defense sectors are already beginning to benefit from the improved size, weight, and power (SWaP) now being demonstrated in power converters utilizing silicon carbide (SiC) and/or gallium nitride (GaN) switches, and numerous manufacturers are offering various types of switching devices fabricated from these two WBG semiconductors.