Microelectronic package characterisation using scanning acoustic microscopy

摘要

In a highly competitive market, reliable techniques for manufacturing quality control of electronic devices are demanded. Characterisation of modern microelectronic package integrity becomes more difficult due to the continued miniaturisation of electronic device and the complexity of advanced micro-assembling technologies such as chip-scale packages and 3D IC stacks. In this paper, sparse representations of acoustic signals are sought to improve the scanning acoustic microscopy (SAM), a common non-destructive tool for failure analysis of microelectronic packages. Sparse representation of an ultrasonic signal is obtained by decomposing it in an overcomplete dictionary. Detection and location of ultrasonic echoes are then performed on the basis of the resulting redundant representation. The method offers a solution to the deconvolution problem for restoration of the ultrasonic reflectivity function. It can restore closely space overlapping echoes beyond the resolution of the conventional SAM system. It also produces high resolution and accurate estimates for ultrasonic echo parameters, i.e., time-of-flight, amplitude, centre frequency, and bandwidth. These merits of the proposed method are explored in various potential applications for microelectronic package characterisation.