Spread Fin Array Heat Sinks

摘要

Advanced Thermal Solutions'maxiFLOW/ maxiGRIP spread fin array heat sinks are made of lightweight, extruded aluminum that maximize air cooling. They reduce device junction temperatures by more than 20 percent compared to heat sinks of similar volume. The system allows for use of high-performance phase-change materials that improve heat transfer and applies steady, even pressure to the device to eliminate the need for PCB holes. The heat sinks are offered in 16 off-the-shelf component sizes, from 17 × 17 mm to 45 × 45 mm, and three low-profile heights.