机译:强磁场对Sn0.3Ni / Cu界面上(Cu,Ni)_6Sn_5形态的影响
School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116085, China;
School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116085, China;
School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116085, China;
high magnetic field; intermetallic compound; (Cu, Ni)_6Sn_5; microstructure; ni content;
机译:Ni-Sn-0.7Cu-0.05Ni / Cu球栅阵列(BGA)接头的(Cu,Ni)_6Sn_5金属间层中的Ni偏析
机译:Ni-Sn-0.7Cu-0.05Ni / Cu球栅阵列(BGA)接头的(Cu,Ni)_6Sn_5金属间层中的Ni偏析
机译:通过控制Ni金属化层的晶粒结构来缓和Sn-Ag-Cu / Ni焊点中(Cu,Ni)_6Sn_5的剥落
机译:通过瞬时液体粘合形成Cu_3SN的Sn-Cu / Sn-Cu-Ni粉末合金和熔融Sn之间的Cu_6SN_5 /(Cu,Ni)_6SN_5金属间化合物
机译:明尼苏达州东北部基底Duluth复杂Cu-Ni-PGE矿化中Ni和Cu同位素分馏的研究
机译:固态时效期间Sn-3.0Ag-0.5Cu焊料与FeCoNiCrCu0.5衬底之间的界面处(FeCrCoNiCu)Sn2金属间化合物的生长受到抑制
机译:磁矩和磁矩的振荡厚度依赖性 界面诱导Co / Cu和Co-Ni / Cu交换耦合的变化 多层
机译:临界磁场(H(sub C2),H(sub C1))和(κ)在YBa2(Cu0.98m0.02)3O(7 +δ)中,m = Ni,al和Cu。