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Electrical properties of PZT thin films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition

机译:电子回旋共振等离子体增强化学气相沉积法沉积PZT薄膜的电学性质

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摘要

Ferroelectric Pb(Zr,Ti)O_3 thin films were successfully fabricated on Pt-coated Si substrates by the electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR PECVD) method using metal-organic (MO) sources. Perovskite structures with well-developed crystalline grains are obtained at a substrate temperature of 500℃. These PZT films, with thicknesses of about 1000 A, show high charge storage densities (P_(max) - P_r = 10-15 μC cm~(-2) for 1.5 V operation) and low leakage current densities (≈10~(-6) A cm~(-2) at 1.5 V). The effects of the Zr/Ti concentration ratio in the film and the rapid thermal annealing on the electrical properties of the films were also studied.
机译:利用金属有机(MO)源,通过电子回旋共振等离子体增强化学气相沉积(ECR PECVD)方法,成功地在涂有Pt的Si衬底上制备了铁电Pb(Zr,Ti)O_3薄膜。在衬底温度为500℃时获得具有发达晶粒的钙钛矿结构。这些厚度约为1000 A的PZT膜显示出高的电荷存储密度(对于1.5 V操作,P_(max)-P_r = 10-15μCcm〜(-2))和低泄漏电流密度(≈10〜(- 6)在1.5 V时为cm〜(-2)。还研究了薄膜中Zr / Ti浓度比和快速热退火对薄膜电性能的影响。

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