New Process For Reclaiming Test Wafers Without Copper Contamination

摘要

A novel wafer reclamation process has been developed to provide copper-contamination-free test wafers. Device manufacturers are concerned with copper contaminated wafers, which result from copper used as a wiring material. A new film removal etchant and polishing slurry have been developed to prevent wafers from being contaminated with copper. These developments have greatly enhanced the reliability of our reclaimed wafers. Furthermore, a method for removing interstitial copper, which penetrated the wafer during the test process, has been developed and successfully applied to the reclamation process.