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Experimental Study on the Ultraprecision Ductile Machinability of Single-Crystal Germanium

机译:单晶锗超精密延展性的实验研究

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摘要

Single-crystal germanium is an important infrared optical material. In the present work, single-point diamond turning experiments on single-crystal germanium (100), (110) and (111) planes were conducted in order to examine their ultraprecision machining characteristics. Three kinds of surface textures and chip morphologies were observed during the brittle-ductile transition of the machining mode. The brittle-ductile boundary changed significantly with the crystal orientations of the workpieces. Due to the crystallographic anisotropy, micro-fractures were generated on the workpiece surface in a radial pattern from the rotation center. However, it was possible to produce completely ductile-cut surfaces on all crystal orientations by using undeformed chip thicknesses smaller than a critical value, namely, the minimum critical undeformed chip thickness, which was approximately 60 nm under the present conditions. Compared to wet cutting, dry cutting was beneficial for ductile machining on a few specific crystal orientations. The findings in this study provide criterions for determining process parameters for the fabrication of aspherical and diffraction infrared optics using single-crystal germanium.
机译:单晶锗是重要的红外光学材料。在当前工作中,在单晶锗(100),(110)和(111)平面上进行了单点金刚石车削实验,以检查它们的超精密加工特性。在加工模式的脆性-延性转变过程中观察到三种表面纹理和切屑形态。脆性-延性边界随着工件的晶体取向而显着变化。由于结晶学各向异性,从旋转中心开始以放射状在工件表面产生微裂纹。然而,通过使用小于临界值的未变形切屑厚度,即最小临界未变形切屑厚度,在当前条件下约为60nm,可以在所有晶体取向上产生完全延展性的切割表面。与湿式切割相比,干式切割有利于在一些特定的晶体方向上进行延性加工。这项研究中的发现为确定使用单晶锗制造非球面和衍射红外光学器件的工艺参数提供了标准。

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