首页> 外文期刊>Journal of thermal stresses >COUPLED THERMO-ELECTRO-MECHANICAL ANALYSIS OF SMART PLATES EMBEDDING COMPOSITE AND PIEZOELECTRIC LAYERS
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COUPLED THERMO-ELECTRO-MECHANICAL ANALYSIS OF SMART PLATES EMBEDDING COMPOSITE AND PIEZOELECTRIC LAYERS

机译:嵌入复合材料和压电层的智能板的热电耦合耦合分析

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摘要

This article considers the static analysis of multilayered piezoelectric plates subjected to mechanical pressures and to field loads such as electric potential and temperature. The Principle of Virtual Displacements has been extended to thermo-electro-mechanical cases by including the virtual internal electric and thermal works and by writing the opportune constitutive relations. The governing equations are given in terms of three main primary variables (displacements, electric potential and temperature) and they are solved in a closed-form solution. The primary variables are expanded in the thickness direction in both Equivalent Single Layer (ESL) and Layer-Wise (LW) form with higher orders of expansion. The models proposed enable to obtain a quasi-3D description of the static thermo-electro-mechanical analysis of multilayered plates and to analyze the effects of each physical field involved. The limitations of classical theories for such analyses have also been discussed.
机译:本文考虑了对多层压电板进行机械压力和电场载荷(例如电势和温度)的静态分析。虚拟位移原理已通过包括虚拟内部电气和热工程以及通过编写适当的本构关系而扩展到热电机械情况。给出了三个主要的主要变量(位移,电势和温度)的控制方程,并用闭式解法求解。主要变量以等效单层(ESL)和明智层(LW)的形式沿厚度方向扩展,具有较高的扩展次数。提出的模型能够获得多层板静态热电机械分析的准3D描述,并分析涉及的每个物理场的影响。还讨论了经典理论在此类分析中的局限性。

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