机译:热物理和几何效应对三维集成电路热性能的影响及优化
Department of Mechanical Engineering, University of California, Riverside, CA 92521;
Department of Mechanical and Aerospace Engineering, University of California, Irvine, CA 92697;
Department of Mechanical Engineering, University of California, Riverside, CA 92521;
Department of Mechanical Engineering, University of California, Riverside, CA 92521;
thermal management; electronic cooling; 3D IC; heat spreader; heat sink; device layer;
机译:硅通孔插入可优化三维集成电路的性能
机译:三维集成电路热性能的分析和数值建模
机译:具有集成微通道冷却的三维集成电路的解析热模型
机译:减薄三维集成电路中堆叠管芯的热效应的研究
机译:适用于高性能二维和三维集成电路的最佳信号,电源,时钟和热互连网络。
机译:单粒门 - 全围绕单片三维集成电路的低热预算过程的Si纳米线FET
机译:三维集成电路的定时,能量和热性能