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机译:GaN-on-SiC半导体器件的极热通量微通道冷却器的热模型
Mechanical Engineering Department, Stanford University, Stanford, CA 94305;
Mechanical Engineering Department, Stanford University, Stanford, CA 94305;
Mechanical and Aerospace Engineering, University of California at Irvine, Irvine, CA 92697;
Mechanical Engineering Department, Stanford University, Stanford, CA 94305;
Department of Civil Engineering and Engineering Mechanics, Columbia University, New York, NY 10027;
Mechanical Engineering Department, Stanford University, Stanford, CA 94305;
Mechanical Engineering Department, Stanford University, Stanford, CA 94305;
microchannel heat sinks; multiscale modeling; GaN-on-SiC;
机译:用于SiC上GaN半导体器件高热通量热管理的微通道冷却器的实验研究
机译:用于硅基嵌入式微通道 - 三维歧管冷却器的热和制造设计考虑部分 - 第2部分:高热通量EMMC的参数研究(〜1 kW / cm〜2)电力电子冷却
机译:外部热流作用下逆流微通道换热器热模型的实验验证
机译:使用嵌入式固液相变材料和固态冷却器对高热通量设备进行动态热管理
机译:基于物理的热阻抗模型,用于仿真半导体器件和电路中的自热。
机译:热电子隧穿设备用作冷却器和放大器
机译:基于膜的蒸发冷却装置的设计与建模,用于高热通量的热管理