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Structural and chemical characteristics of atomically smooth GaN surfaces prepared by abrasive-free polishing with Pt catalyst

机译:通过使用Pt催化剂进行无磨擦抛光制备的原子光滑GaN表面的结构和化学特性

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摘要

This paper reports the structural and chemical characteristics of atomically flat gallium nitride (GaN) surfaces prepared by abrasive-free polishing with platinum (Pt) catalyst. Atomic force microscopy revealed regularly alternating wide and narrow terraces with a step height equivalent to that of a single bilayer on the flattened GaN surfaces, which originate from the differences in etching rate of two neighboring terraces. The material removal characteristics of the method for GaN surfaces were investigated in detail. We confirmed that an atomically smooth GaN surface with an extremely small number of surface defects, including pits and scratches, can be achieved, regardless of the growth method, surface polarity, and doping concentration. X-ray photoelectron spectroscopy showed that the flattening method produces clean GaN surfaces with only trace impurities such as Ga oxide and metallic Ga. Contamination with the Pt catalyst was also evaluated using total-reflection X-ray fluorescence analysis. A wet cleaning method with aqua regia is proposed, which markedly eliminates this Pt contamination without affecting the surface morphology.
机译:本文报道了通过用铂(Pt)催化剂进行无磨擦抛光制备的原子平坦的氮化镓(GaN)表面的结构和化学特性。原子力显微镜显示规律地交替交替的宽和窄台阶,其台阶高度等于平坦GaN表面上单个双层的台阶高度,这是由于两个相邻台阶的蚀刻速率不同而引起的。详细研究了GaN表面方法的材料去除特性。我们证实,无论生长方法,表面极性和掺杂浓度如何,都可以实现具有极少量表面缺陷(包括凹痕和划痕)的原子光滑GaN表面。 X射线光电子能谱显示,该平坦化方法可产生干净的GaN表面,仅具有痕量杂质(例如Ga氧化物和金属Ga)。还使用全反射X射线荧光分析评估了Pt催化剂的污染。提出了使用王水的湿法清洁方法,该方法可在不影响表面形态的情况下显着消除这种Pt污染。

著录项

  • 来源
    《Journal of Crystal Growth》 |2012年第1期|83-88|共6页
  • 作者单位

    Department of Mechanical Engineering, Ritsumeikan University, 1-1-1 Nojihigasi, Kusatsu, Shiga 525-8577, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan;

    Ebara Corp., 4-2-1 Honfujisawa, Fujisawa, Kanagawa 251-8502, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

    Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    A1. Defects; A1. Etching; A1. Substrates; A1. Surface structure; B2. Semiconducting Ⅲ-Ⅴ materials;

    机译:A1。缺陷;A1。蚀刻;A1。基材;A1。表面结构;B2。半导体Ⅲ-Ⅴ材料;

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