首页> 外文期刊>Japanese journal of applied physics >Characteristics of Gate Current Random Telegraph Signal Noise in SiON/HfO_2/TaN p-Type Metal-Oxide-Semiconductor Field-Effect Transistors under Negative Bias Temperature Instability Stress Condition
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Characteristics of Gate Current Random Telegraph Signal Noise in SiON/HfO_2/TaN p-Type Metal-Oxide-Semiconductor Field-Effect Transistors under Negative Bias Temperature Instability Stress Condition

机译:负偏置温度不稳应力条件下SiON / HfO_2 / TaN p型金属氧化物半导体场效应晶体管中栅极电流随机电报信号噪声的特性

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摘要

Gate dielectric traps are becoming a major concern in the high-k/metal gate devices. In this paper, new experimental results and in-depth study on gate current random telegraph signal (I_g RTS) noise in SiON/HfO_2/TaN gate stack p-type metal-oxide-semiconductor field-effect transistors (PMOSFETs) are reported. Single carrier trapping/detrapping in the high-k/metal gate stack under negative bias temperature instability (NBTI) stress is observed for the first time. The location of traps, the impacts of gate bias, temperature and substrate bias are discussed for understanding the RTS mechanism in high-k devices. Moreover, during long time stress, an abrupt change of amplitude of I_g fluctuation and the mean capture and emission time is also observed for the first time, due to new trap generated or activated by the NBTI degradation. The characteristics of the single carrier trapping/detrapping behavior under NBTI stress are very different from that on the normal bias condition, which give us more information about the traps in the high-k/metal gate stack.
机译:栅极电介质陷阱正成为高k /金属栅极器件中的主要问题。本文报道了SiON / HfO_2 / TaN栅叠层p型金属氧化物半导体场效应晶体管(PMOSFET)中栅极电流随机电报信号(I_g RTS)噪声的新实验结果和深入研究。首次在负偏置温度不稳定性(NBTI)应力下在高k /金属栅堆叠中捕获单载流子。讨论了陷阱的位置,栅极偏置,温度和衬底偏置的影响,以了解高k器件中的RTS机制。此外,在长时间的应力作用下,由于NBTI降解产生或激活了新的陷阱,因此也首次观察到I_g波动幅度的突然变化以及平均捕获和发射时间。 NBTI应力下单载流子的俘获/去俘获特性与正常偏置条件下的特征有很大不同,这为我们提供了有关高k /金属栅叠层中陷阱的更多信息。

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  • 来源
    《Japanese journal of applied physics》 |2010年第4issue2期|P.04DC08.1-04DC08.4|共4页
  • 作者单位

    Institute of Microelectronics, Peking University, Beijing 100871, P. R. China;

    rnInstitute of Microelectronics, Peking University, Beijing 100871, P. R. China;

    rnInstitute of Microelectronics, Peking University, Beijing 100871, P. R. China;

    rnInstitute of Microelectronics, Peking University, Beijing 100871, P. R. China;

    rnInstitute of Microelectronics, Peking University, Beijing 100871, P. R. China;

    rnInstitute of Microelectronics, Peking University, Beijing 100871, P. R. China;

    rnSEMATECH, Austin, TX 78741, U.S.A.;

    rnIngram School of Engineering, Texas State University-San Marcos, San Macros, TX 78666, U.S.A.;

    rnInstitute of Microelectronics, Peking University, Beijing 100871, P. R. China;

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