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Potentiality of IMPATT Devices as Terahertz Source: An Avalanche Response Time-based Approach to Determine the Upper Cut-off Frequency Limits

机译:IMPATT装置作为太赫兹的潜力来源:一种基于雪崩响应时间的方法来确定上限截止频率极限

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摘要

Potentiality of Impact Avalanche Transit Time (IMPATT) devices based on different semiconductor materials such as InP, 4H-SiC, and Wurtzite-GaN (Wz-GaN) has been explored for operation at terahertz (THz) frequencies. Drift-diffusion model is used to design double-drift region (DDR) IMPATTs based on above mentioned materials at different millimeter-wave (mm-wave) and THz frequencies and the upper cut-off frequency limits of those devices are obtained from the avalanche response times at those mm-wave and THz frequencies. Results show that the upper cut-off frequency limits of both InP and 4H-SiC DDR IMPATTs are 1.0 THz; whereas, the same is 5.0 THz in Wz-GaN DDR IMPATTs. The Wz-GaN DDR IMPATTs emerge as the most suitable devices for generation of THz frequencies due to their small avalanche response time, high DC to RF conversion ratio, and sufficiently high RF power output at THz frequencies. But, it is observed that up to 1.0 THz, 4H-SiC DDR IMPATTs excel Wz-GaN DDR IMPATTs due to their higher output power densities. Thus, the wide bandgap semiconductors such as Wz-GaN and 4H-SiC are highly suitable materials for DDR IMPATTs at both mm-wave and THz frequency ranges.
机译:已经研究了基于InP,4H-SiC和Wurtzite-GaN(Wz-GaN)等不同半导体材料的冲击雪崩渡越时间(IMPATT)器件的工作频率为太赫兹(THz)的可能性。使用漂移扩散模型基于上述材料在不同的毫米波(mm-wave)和THz频率下设计双漂移区(DDR)IMPATT,并从雪崩中获得了这些器件的截止频率上限在这些毫米波和太赫兹频率下的响应时间。结果表明,InP和4H-SiC DDR IMPATT的截止频率上限均为1.0 THz。而在Wz-GaN DDR IMPATT中相同的是5.0 THz。 Wz-GaN DDR IMPATT由于其雪崩响应时间短,DC / RF转换比高以及在THz频率下具有足够高的RF功率输出而成为最适合产生THz频率的设备。但是,据观察,由于其较高的输出功率密度,高达1.0 THz的4H-SiC DDR IMPATT优于Wz-GaN DDR IMPATT。因此,宽带隙半导体,例如Wz-GaN和4H-SiC,是在毫米波和THz频率范围内用于DDR IMPATT的高度合适的材料。

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