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首页> 外文期刊>IEEE transactions on device and materials reliability >Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material
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Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material

机译:制造工艺对烧结银模切附着材料微观变形行为的影响

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Effects of pressurization and thermal-processing conditions on the deformation properties of sintered-silver sheets, excluding the contribution of the voids, (hereinafter, referred to as “micro-deformation properties”) were evaluated. Three types of thin-plate specimen sintered under the different conditions were prepared and these micro-deformation properties were compared. The first type was pressurized at 10 MPa for 10 min in the atmosphere at 573 K, the second type was annealed at 573 K for six hours before pressure processing and pressurized at 10 MPa for 10 min in the atmosphere at 573 K, and the third type was not pressurized and sintering in the atmosphere at 573 K for 10 min. The micro-deformation properties of these specimens were estimated by tensile testing and finite-element analysis (FEA) using a model that reproduces the microporous-structure. The microporous-structure models were made from serial cross-sectional images obtained by focused-ion-beam scanning electron microscope. These estimation results indicate that the micro-deformation properties of sintered-silver sheets do not depend on pressure, but on thermal-process conditions. The estimated micro-deformation properties were compared with those determined by nanoindentation tests and the validity of the estimated micro-deformation properties was confirmed. A deformation property of non-pressurized specimens was predicted by using the estimated micro-deformation properties and the microporous structures obtained from the pressurized specimens. The predicted deformation properties corresponded to experimental one. It is therefore concluded that if the deformation properties and microporous-structure of a sintered-silver specimen under a certain condition are determined, it is possible to predict the porosity dependency of deformation properties by FEA.
机译:评估了加压和热处理条件对烧结银板的变形性能的影响,除了空隙的影响外,以下(称为“微变形性能”)。制备了三种在不同条件下烧结的薄板试样,并比较了它们的微变形性能。第一种在压力573 K的气氛中以10 MPa的压力加压10分钟,第二种在压力处理之前在573 K的温度下退火6小时,然后在573 K的气氛中以10 MPa的压力加压10分钟。不加压,在573 K的气氛中烧结10分钟。这些样品的微变形特性是通过拉伸测试和有限元分析(FEA)使用可再现微孔结构的模型估算的。由通过聚焦离子束扫描电子显微镜获得的系列横截面图像制成微孔结构模型。这些估计结果表明,烧结银板的微变形特性不取决于压力,而是取决于热处理条件。将估计的微形变性质与通过纳米压痕测试确定的微形变性质进行比较,并确认了估计的微形变性质的有效性。通过使用估计的微形变特性和从加压样品中获得的微孔结构,可以预测非加压样品的变形性能。预测的变形特性与实验值相对应。因此得出的结论是,如果确定了一定条件下的烧结银试样的变形特性和微孔结构,则可以通过有限元分析预测变形特性的孔隙率依赖性。

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