Introduction to the Issue on Photonic Packaging and Integration Technologies

摘要

The Guest Editors of the IEEE Journal Of Selected Topics In Quantum Electronics (JSTQE) are pleased to introduce this issue on Photonic Packaging and Integration Technologies. As the demands for higher bandwidth density, low latency, low-energy communications, and smaller footprint steadily increase, conventional electrical interconnects will not be able to deliver. Optical devices and optical interconnects can overcome these limitations. As a result, vast amount of work is currently being carried out in the development of optical interconnects, optical printed circuit boards, and chip-to-chip as well as onchip optical interconnections and devices. Footprint and cost reduction can be achieved through the miniaturization of optical components and their CMOS compatible on-chip integration. Bringing light in and out the highly integrated and miniaturized devices is challenging especially, since the solutions should be cost effective and manufacturable. As optical packages become more compact and dense, new problems arise in reconciling the I/O bandwidth, power delivery, and cooling needs. The 13 Invited Papers written by leading researchers in the field provide a comprehensive overview of the state of the art of several topics divided in the following subtopics: 1) on-chip integration technologies and optical interconnects; 2) chip-tochip and board-to-board interconnects; 3) packaging and testing technologies; and 4) enabling devices towards fully integrated systems. There are 14 contributed papers covering topics that are of critical importance in the field of photonics integration and packaging. The topic of this publication represents an area of increased interest in the photonics community and this publication constitutes an important milestone, putting together the latest developments in this growing field.