Sockets enable area-array device tests to 200℃

摘要

AR4HT Series CSP sockets accept any packaged area-array device - including BGA, LGA, QFN, DFN, CSP, MLCC and POP - as well as bumped die with full and partial arrays, for high-temperature testing up to 200℃. The sockets Incorporate a low-profile 0.45-mm contact structure (compressed) that is shorter than other low-profile contacts, providing excellent compliance for reliable ATE testing and burn-in. The sockets suit testing for military, aerospace, and geophysical applications, as well as R&D.