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A three-step method for the de-embedding of high-frequency S-parameter measurements

机译:消除高频S参数测量的三步法

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The authors propose a general method of deembedding S-parameter measurements of the device-under-test (DUT) for which typical parasitics associated with probe pads and interconnect-metal lines can be deembedded from the measurement. The DUT is the analog silicon bipolar junction transistor including the pad and interconnects. This method includes the subtraction of the parasitic shunt y-parameters of the on-wafer open calibration pattern as well as the subtraction of the parasitic series z-parameters on the on-wafer open circuit which are taken from measurements of the short and through circuits. It is demonstrated that the calculated power loss for the pad and interconnect parasitics can be comparable to the power consumption of the advanced bipolar transistor at high frequencies (
机译:作者提出了一种将被测器件(DUT)的S参数测量去嵌入的通用方法,该方法可以从测量中消除与探头焊盘和互连金属线相关的典型寄生现象。 DUT是包括焊盘和互连的模拟硅双极结型晶体管。该方法包括减去晶圆上开路校准图案的寄生并联y参数以及减去晶圆上开路的寄生串联z参数,这些参数是通过短路和直通电路的测量得出的。已经证明,在高频(<或= 10 GHz)下,焊盘和互连寄生的计算出的功率损耗可以与先进的双极晶体管的功耗相媲美。寄生去嵌入电路元件的大小和类型的知识可以帮助设备工程师分析与去嵌入相关的误差。

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